Resin flooring framework - feedback wanted on substrate preparation
With the Resin Flooring Network website launched and the 3-month review period for the draft framework underway, I’ve put together a series of posts aimed at encouraging input from industry stakeholders.
Over the coming weeks I’ll be posting the core elements of the draft framework so that everyone can see what the training program looks like so far and, more importantly, how they might contribute to developing it further.
The second element is substrate preparation, with the proposed Scope, Key Learning Outcomes, Theoretical Assessment Criteria and Practical Assessment Criteria detailed below.
This module covers the standard methods of surface preparation with respect to resin flooring. This includes the mechanical profiling of concrete, as well as degreasing and sanding between coats.
Key Learning Outcomes
To be able to use the most suitable surface preparation method depending on the condition of the substrate and the coating system applied.
Theoretical Assessment Criteria
- The process of cleaning a contaminated substrate.
- The process of acid etching and its suitability as a form of surface preparation.
- The process of dustless diamond grinding, including diamond selection and dust collection, and its suitability as a form of surface preparation.
- The process of shot blasting and its suitability as a form of surface preparation.
- The process of scabbling and its suitability as a form of surface preparation.
- The process of sanding and its suitability as a form of surface preparation.
Practical Assessment Criteria
- The safe and effective use of each method of surface preparation method.
We want your feedback!
This draft is intended as a starting point for discussion only and we welcome honest feedback from all stakeholders – the good, the bad and the ugly! If you’d like to suggest any changes or additions to improve this element of training, please add your comment on the dedicated Resin Flooring Network page –
Take care and keep smiling,